DE
Y-RED Evaluation & Failure Analysis Socket
- Home
- Test Solutions
- Kontaktierung von Halbleitern
- Y-RED Evaluation & Failure Analysis Socket
Alle Produkte zeigen
- Interface Solutions
- Kontaktierung von Halbleitern
- Universalsockel IC561, IC564 & NP584
- Y-RED Evaluation & Failure Analysis Socket
- Ball and Pad Devices (BGA CSP LGA)
- Quad Flat Non-Leaded (QFN)
- Quad Flat Packages Gullwing Leads (QFP)
- Small Outline Packages Gullwing Leads (SOP)
- J-Leads (SOJ PLCC)
- Non-Leaded Devices (LCC)
- Single Inline Package (SIP)
- Dual Inline Package (DIP)
- Burn-In Lead Frame Sockets
- PCB Full Custom Solutions
- Specialities – Customized Designs
