- Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages
- IC package dimensions from 2 x 2 to 10 x 10 sqmm
- Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular
Features
Advantages
- ability to support both burn-in & validation test
- Compression Mount Technology (CMT) for quick installation and maintenance
- Full flexibility through drilled insulator and milled pusher
Specifications
General Specification
- Mating Cycles
20,000 - Operating Temperature Range
-40 °C – 150 °C - Socket Type
Clamshell
Electrical Specification
- (Initial) Contact Resistance
500 Milliohm - Insulation Resistance
1 Megaohm - (Dieletric) Withstanding Voltage
100 V AC - Current Rating
1,15 A
Interface Specification
- Pin Count / Numbers of pins
280