- Y-SPE6-J1STTFP-01-NOALR1T
- Mating face according to IEC 63171-6
- 180° version for THR soldering
- Small in size and weight
- Future oriented technology towards industry 4.0
Features
Advantages
- Future oriented technology as preparation to industry 4.0
- Both mating faces acc. to IEC 63171-2 / -6 available
- Saves space cost and weight
- 90° and 180° Jacks in IP20 and IP67 (IEC 63171-6)
- 90° Jack (IEC 63171-2)
Specifications
General Specification
- Mating Cycles
1,000 - Operating Temperature Range
-40 °C – 85 °C - Plating type, technology and coating thickness
In contact area:Min 30μ’’ Au over min 60μ’’ Ni
In soldering area:Min.80μ’’ Sn over min.60μ’’Ni - Packaging
Tray - Contact Type
Solder - IP Class
IP20
Electrical Specification
- (Initial) Contact Resistance
10 Milliohm at 4 A - Insulation Resistance
500 Milliohm at 500 - (Dieletric) Withstanding Voltage
1000 V DC for 1 minute pin to pin - Current Rating
4 A 1 minute pin to shield/ground - Voltage Rating
60 V DC
Interface Specification
- Soldering Technology
THR & SMD - In case of THR or SMD: according to
J-STD-020D or newer - Pitch
2.8 - Pin Count / Numbers of pins
2 - Contact Type
Solder